566-290-711

EDAC
587-566-290-711
566-290-711

Mfr.:

Description:
Pin & Socket Connectors 566 REC (F) AWG 22-28

Datasheet:
ECAD Model:
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Learn more about EDAC 566-290-711

In Stock: 13,533

Stock:
13,533 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
€0.172 €0.17
€0.148 €1.48
€0.131 €3.28
€0.114 €11.40
€0.101 €25.25
€0.083 €83.00
€0.078 €195.00
€0.074 €370.00
€0.071 €852.00

Product Attribute Attribute Value Select Attribute
EDAC
Product Category: Pin & Socket Connectors
RoHS:  
Contacts
Pin (Male)
Crimp
Wire
Copper Alloy
Tin
300 V
566
Brand: EDAC
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Product Type: Pin & Socket Connectors
Factory Pack Quantity: 12000
Subcategory: Pin & Socket Connectors
Wire Gauge Max: 22 AWG
Wire Gauge Min: 28 AWG
Unit Weight: 320 mg
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Attributes selected: 0

Datasheet

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TARIC:
8536901000
CNHTS:
8538900000
CAHTS:
8536900020
USHTS:
8536904000
JPHTS:
853690000
MXHTS:
8536902800
BRHTS:
85389090
ECCN:
EAR99

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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