627-11W1224-1N1

EDAC
587-627-11W1224-1N1
627-11W1224-1N1

Mfr.:

Description:
D-Sub Mixed Contact Connectors 627 Series vertical Combo' D-Sub plug connector, 11W1 layout, gold flash plating, PCB tails, nickel plated shell

Datasheet:
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In Stock: 250

Stock:
250 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
€5.01 €5.01
€4.26 €42.60
€3.99 €99.75
€3.80 €190.00
€3.62 €362.00
€3.35 €837.50
€3.23 €1,615.00
€3.07 €3,070.00
€2.91 €7,275.00

Product Attribute Attribute Value Select Attribute
EDAC
Product Category: D-Sub Mixed Contact Connectors
REACH - SVHC:
11W1
11 Position
Through Hole
Vertical
Solder Cup
Brand: EDAC
Contact Material: Copper
Contact Plating: Gold
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Current Rating: 10 A
Filtered: Unfiltered
Gender: Male
Insulation: Insulated
Insulation Material: Thermoplastic Polyester
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
Product Type: Mixed Contact D-Sub Connectors
Series: 627
Shell Material: Steel
Shell Plating: Nickel
Factory Pack Quantity: 1
Subcategory: D-Sub Connectors
Voltage Rating: 125 V
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Attributes selected: 0

Datasheet

Images

Models

TARIC:
8536693000
USHTS:
8536694040
ECCN:
EAR99

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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