MCLA1608V2-331-R

Eaton Electronics
504-MCLA1608V2-331-R
MCLA1608V2-331-R

Mfr.:

Description:
RF Inductors - SMD MCLA Auto Chip IND 1608 330nH 2 Pads

Datasheet:
ECAD Model:
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Learn more about Eaton Electronics MCLA1608V2-331-R

In Stock: 964

Stock:
964 Can Dispatch Immediately
Factory Lead Time:
21 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
€0.086 €0.09
€0.044 €0.44
€0.039 €0.98
€0.036 €3.60
€0.028 €70.00
Full Reel (Order in multiples of 4000)
€0.026 €104.00

Product Attribute Attribute Value Select Attribute
Eaton
Product Category: RF Inductors - SMD
RoHS:  
Multilayer
0603 (1608 metric)
Unshielded
330 nH
5 %
500 mA
2.8 Ohms
- 40 C
+ 125 C
8
350 MHz
Standard
1.6 mm
0.8 mm
0.8 mm
AEC-Q200
MCLA
Reel
Cut Tape
Brand: Eaton Electronics
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 4000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Unit Weight: 380 g
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Attributes selected: 0

Datasheet

Design Tools

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TARIC:
8504500090
CNHTS:
8504500000
CAHTS:
8504500000
USHTS:
8504508000
JPHTS:
850450000
KRHTS:
8504502090
MXHTS:
8504509199
BRHTS:
85045000
ECCN:
EAR99

MCLA / WCLA AEC-Q200 Chip Inductors

Eaton Electronics MCLA Multilayer Chip Inductors and WCLA Wirewound Chip Inductors are AEC-Q200 qualified and designed for infotainment, wireless communications, and other automotive applications. The multilayer monolithic construction of the MCLA inductors yields a high reliability. The WCLA inductors, meanwhile, offer tight inductance tolerance and a high Q value. These automotive chip inductors come in a variety of package sizes and inductance ranges. These Eaton Electronics inductors operate over a -40°C to +125°C temperature range.

5G Applications

Eaton Electronics offers an expansive portfolio of high-reliability components needed to drive 5G forward. Because 5G telecommunication units are typically placed in rugged environments, continuous uptime requirements for their operation and the reliability of the internal electronics are of great importance. A variety of components, often passives, can be readily added in key locations within 5G communications systems to enhance reliability and mitigate subcircuits susceptible to electrostatic discharge (ESD), electromagnetic interference (EMI), and electromagnetic pulse (EMP). Eaton 5G products can withstand harsh environments while delivering high performance.

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