1008AS-1R0J-01

Fastron
434-1008AS-1R0J-01
1008AS-1R0J-01

Mfr.:

Description:
RF Inductors - SMD 1000nH 25 MHz 5%

Datasheet:
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In Stock: 674

Stock:
674 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
€0.327 €0.33
€0.276 €2.76
€0.255 €6.38
€0.197 €19.70
€0.187 €46.75
€0.145 €145.00
Full Reel (Order in multiples of 2000)
€0.113 €226.00
€0.106 €424.00
€0.104 €1,040.00
† A MouseReel™ fee of €5.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fastron
Product Category: RF Inductors - SMD
RoHS:  
Wirewound
1008 (2520 metric)
Unshielded
1 uH
5 %
370 mA
1.75 Ohms
- 40 C
+ 125 C
36
290 MHz
Standard
2.9 mm
2.8 mm
2.1 mm
Ceramic
AEC-Q200
1008AS
Reel
Cut Tape
MouseReel
Application: RF
Brand: Fastron
Case Code - in: 1008
Case Code - mm: 2520
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MY
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 2000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Test Frequency: 25 MHz
Unit Weight: 100 mg
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Attributes selected: 0

Datasheet

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TARIC:
8504500090
CNHTS:
8504500000
CAHTS:
8504500000
USHTS:
8504508000
JPHTS:
850450000
KRHTS:
8504502090
MXHTS:
8504509199
BRHTS:
85045000
ECCN:
EAR99

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.

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