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2007705-1

Name: TE Connectivity 2007705-1
Brand: TE Connectivity
SKU: 571-2007705-1
Price: 15.87 EUR
Availability: InStock

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Mouser No:

571-2007705-1

Mfr. No:

2007705-1

Mfr.:

TE Connectivity

Description:

High Speed/Modular Connectors 3 PR 10 COL RECPT HI DENSITY BACKPLANE

Datasheet:

2007705-1 Datasheet

ECAD Model:

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More Information

Learn more about TE Connectivity 2007705-1

In Stock: 47

Stock:: 47 Can Dispatch Immediately

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Factory Lead Time:: 4 Weeks Estimated factory production time for quantities greater than shown.

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	€15.87	€15.87
	€13.48	€134.80
	€12.60	€327.60
	€12.00	€624.00
	€11.43	€1,188.72
	€11.27	€2,930.20
	€10.24	€10,383.36

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Receptacles
Number of Positions:	90 Position
Number of Rows:	9 Row
Pitch:	1.9 mm
Termination Style:	Press Fit
Contact Plating:	Gold
Series:	IMPACT Backplane
Brand:	TE Connectivity
Contact Material:	Copper Alloy
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	750 mA
Housing Material:	Liquid Crystal Polymer (LCP)
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	26
Subcategory:	Backplane Connectors
Voltage Rating:	30 VDC
Unit Weight:	12.864 g

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Datasheet

2007705-1 Datasheet

Images

Models

2007705-1 Symbol & Footprint by SnapMagic

PCN

Product Change Notification_2025_1_20 (PDF)

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

IMPACT™ High Density Backplane Connectors

TE Connectivity's IMPACT™ Connector System meets the increased speed and density requirements of future system upgrades and next generation data networking and telecommunications equipment. TE's IMPACT High Density Backplane Connectors feature unique broad-edge coupled design which utilizes low impedance and a localized ground return path in an optimized differential pair array. The differential pairs are tightly coupled at 80 pairs per linear inch, and are surrounded by ground structures to isolate the pairs. This innovative design enables the IMPACT High Density Backplane Connectors to achieve data rates up to 25Gb/s, reduce crosstalk, and improve overall bandwidth performance with minimal performance variance. The IMPACT High Density Backplane Connectors offered by TE are ideally suited for high speed, backplane applications such as switches, servers/blade servers, storage, and routers.