CGA6P1X7S1N106K250AE

TDK
810-CGA6P1X7S1N106K2
CGA6P1X7S1N106K250AE

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT Soft Term, MLCC, 1210, X7S, 75V, 10uF, 2.5mm, AEC-Q200

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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Learn more about TDK CGA6P1X7S1N106K250AE

Availability

Stock:
0

You can still purchase this product for backorder.

Factory Lead Time:
24 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
€-.--
Ext. Price:
€-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 1000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
€1.11 €1.11
€0.573 €5.73
€0.525 €52.50
€0.446 €223.00
Full Reel (Order in multiples of 1000)
€0.43 €430.00
€0.399 €798.00
€0.381 €1,905.00
€0.371 €3,710.00
€0.369 €9,225.00
† A MouseReel™ fee of €5.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
TDK
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
10 uF
75 VDC
X7S
10 %
1210
3225
SMD/SMT
Flexible (Soft)
- 55 C
+ 125 C
3.2 mm (0.126 in)
2.5 mm (0.098 in)
2.5 mm (0.098 in)
Ceramic Capacitors
CGA
Reel
Cut Tape
MouseReel
Brand: TDK
Class: Class 2
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Package/Case: 1210 (3225 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 1000
Subcategory: Capacitors
Type: Automotive
Part # Aliases: CGA6P1X7S1N106KT0Y0S
Products found:
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Attributes selected: 0

Datasheet

TARIC:
8532240000
CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
KRHTS:
8532240000
MXHTS:
8532240400
BRHTS:
85322410
ECCN:
EAR99

Automotive Capacitors

TDK Automotive Capacitors are multilayer ceramic chip capacitors (MLCCs) that meet AEC-Q200 standards. TDK MLCCs are manufactured using tested and stable manufacturing processes, and parts are subjected to increased inspection to offer a high level of reliability. Products are available in general voltage up to 50V, mid-voltage up to 630V, and high temperature up to +150°C. They also come in SMD or leaded packages. TDK Automotive Capacitors can be used for crack mitigation solutions such as soft terminations and open-mode designs, automotive applications such as battery line smoothing, engine control units, and sensor modules.

CGA Automotive MLCCs

TDK CGA Automotive Multilayer Ceramic Chip Capacitors (MLCCs) are AEC-Q200 compliant and feature a tested and stable manufacturing process with increased inspections. These capacitors are available in voltage ratings up to 3kVDC and up to a +150°C operating temperature. In addition, thinner ceramic dielectric layers and multilayer technology give these capacitors a large capacitance. The series is available in standard, flexible (soft), and conductive epoxy terminations. TDK CGA MLCCs are used in a variety of applications, including automotive powertrain systems and safety equipment, smart meters, power supplies, sensor modules, and higher reliability / safety applications.

Automotive Products

TDK, recognized as an industry leader in passive electronic components, offers many product series related to automotive applications. TDK’s wide array of products, including MLCCs, inductors, ferrite beads, and more, utilizes specialized materials and unique structural designs. These materials and designs offer high performance and reliability under the most severe usage conditions and in the harsh environments found in automotive applications.

CGA Automotive Grade Soft Termination MLCCs

TDK CGA Automotive Grade Soft Termination Multilayer Ceramic Chip Capacitors (MLCCs) incorporate a conductive resin layer into the terminal electrodes. The resin layer protects the ceramic body from cracks by relieving stress due to thermal shock and board flexure. These capacitors feature 4.7μF or 10μF capacitance and come in 3225 (1210") dimensions. The CGA soft termination MLCCs are used in fail-safe design for battery lines, mobile devices, and smart keys that have a high possibility of drop. Other applications include the prevention of ceramic element cracks by board bending and the prevention of solder cracks by thermal shock.

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