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GP1500S30-0.125-02-0816

Name: Bergquist Company GP1500S30-0.125-02-0816
Brand: Bergquist Company
SKU: 951-GP15030012502816
Price: 117.06 EUR
Availability: OutOfStock

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Mouser No:

951-GP15030012502816

Mfr. No:

GP1500S30-0.125-02-0816

Mfr.:

Bergquist Company

Description:

Thermal Interface Products GAP PAD, S-Class, 8"x16" Sheet, 0.125" Thickness, 2 Side Tack, TGP1300/1500S30

This product will be sent to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated dispatch date.

Datasheet:

GP1500S30-0.125-02-0816 Datasheet (PDF)

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Learn more about Bergquist Company GP1500S30-0.125-02-0816

Availability

Stock:: 0

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Factory Lead Time:: 6 Weeks Estimated factory production time.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	€117.06	€936.48
	€105.18	€1,051.80
	€98.64	€2,466.00
	€95.06	€4,753.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Bergquist Company
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Thermal Pad
Package/Case:	Non-standard
Material:	Silicone Elastomer
Thermal Conductivity:	1.3 W/m-K
Breakdown Voltage:	6 kVAC
Color:	Pink
Minimum Operating Temperature:	- 60 C
Maximum Operating Temperature:	+ 200 C
Length:	406.4 mm
Width:	203.2 mm
Thickness:	3.175 mm
Tensile Strength:	16 psi
Flammability Rating:	UL 94 V-0
Series:	1500S30 / TGP 1300
Brand:	Bergquist Company
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Designed for:	Heat Sinks, Computer and Peripherals, Telecommunications, Semiconductors, Shielding Devices
Product Type:	Thermal Interface Products
Size:	8 in x 16 in
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Tradename:	GAP PAD
Part # Aliases:	L16INW8INH0.125 SH BG424928 L16INW8INH0D0 2166885
Unit Weight:	504.233 g

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USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.